this is information on a product in full production. july 2014 docid024489 rev 1 1/7 EMIF05-SK01F3 5 line ipad?, emi filter including esd protection datasheet ? production data features ? emi (i/o) low-pass filter ? high efficiency in emi/esd protection ? very thin package ? lead-free package ? high reliability offered by monolithic integration ? high reduction of parasitic elements through integration and wafer level packaging complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) ? iec 61000-4-2 level 1: ? 2 kv (air discharge) ? 2 kv (contact discharge) applications where emi filtering in esd sensitive equipment is required: ? mobile phones and comm unication systems ? computers, printers and mcu boards. tm : ipad is a trademark of stmicroelectronics description the EMIF05-SK01F3 chip is a highly integrated filter device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up to 15 kv. figure 1. pin configuration (bump view) figure 2. functional schematic flip chip 11 bumps table 1. pin name input output i1 (a1) o1 (b3) i2 (a2) o2 (a3) i3 (b1) o3(c3) i4 (c1) o4 (d3) i5 (d1) o5 (d2) i1 1 2 3 a b c d i3 i4 i5 i2 gnd o5 o2 o1 o3 o4 input i1 to i5 output o1 to o5 1 nf 4.7 k esd level 4 (8 kv contact) c2 gnd www.st.com
characteristics EMIF05-SK01F3 2/7 docid024489 rev 1 1 characteristics figure 3. electrical characteristics (definitions) table 2. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp external pins (a1, a2, b1, c1, d1): esd discharge iec 61000-4-2, level 4 air discharge contact discharge internal pins (a3, b3, c3, d3, d2): esd discharge iec 61000-4-2 (1) , level 1 air discharge contact discharge 1. measurements done on iec 61000-4-2 test bench.for further details see application note an3353, ?iec 61000-4-2 standard testing?. 15 8 2 2 kv t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to 150 table 3. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit i rm v rm = 3 v 200 na v br i r = 1 ma 6 10 v r1 , r2, r3, r4, r5 v line = 0 v, v osc = 30 mv, f = 1 mhz 4.23 4.7 5.17 ? c1, c2, c3, c4, c5 v line = 0 v, v osc = 30 mv, f = 1 mhz (measured under zero light conditions) 0.8 1 1.2 nf symbol p arameter v = breakdown voltage i = leakage current at v v = stand-off voltage c x r x= = line capacitance br rm rm rm series resistance between input and ouptput
docid024489 rev 1 3/7 EMIF05-SK01F3 characteristics 7 figure 8. line capacitance versus applied voltage figure 4. attenuation versus frequency figure 5. analog crosstalk versus frequency s21(db) 100k 1m 10m 100m 1g -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 i1-o1 i2-o2 i3-o3 i4-o4 i5-o5 f (hz) xtalk (db) 100k 1m 10m 100m 1g -90 -80 -70 -60 -50 -40 -30 -20 -10 0 i1-o2 i1-o5 figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 2.0 v / div 20 ns / div v : peak clamping voltage cl v :clamping voltage at 30 ns cl v :clamping voltage at 60 ns cl v :clamping voltage at 100 ns cl 1 2 3 4 1.20 v 4 3.16 v 3 3.61 v 2 11.87 v 1 2.0 v / div -10.88 v 1 -5.19 v 2 -4.18 v 3 -1.73 v 4 v : peak clamping voltage cl v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 20 ns / div c(pf) 0 20 0 40 0 60 0 80 0 100 .0 120 .0 01 2 34 5 67 v bias (v)
package information EMIF05-SK01F3 4/7 docid024489 rev 1 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. package dimensions figure 10. footprint figure 11. marking 1180 30 m 400 30 m 400 30 m 1580 30 m 175 m 175 m 255 40 m 500 m 50 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum kn dot, st logo ecopack ? grade
docid024489 rev 1 5/7 EMIF05-SK01F3 package information 7 figure 12. tape and reel specification 8.0 +0.3 -0.10 4.0 0.1 1.75 0.1 3.5 - 0.05 1.28 0.05 dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 0.1 2.0 0.05 ? 1.50 0.10 0.59 0.05 0.20 0.02 1.65 0.05 kn kn kn
ordering information EMIF05-SK01F3 6/7 docid024489 rev 1 3 ordering information figure 13. ordering information scheme note: more information is available in the stmicroelectronics application notes: an2348: ?flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? 4 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF05-SK01F3 kn flip chip 2.0 mg 5000 tape and reel 7? emif 05 - sk 01 f3 emi filter number of lines application 2 letters = sk version 2 digits = 01 package f = flip chip x = 3: lead-free pitch = 400 m, bump = 255 m table 5. document revision history date revision changes 07-jul-2014 1 first issue.
docid024489 rev 1 7/7 EMIF05-SK01F3 7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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